Past Activities
The intermediate diffusion barrier performance of electroless Co-W-B / Ni-P stacked deposits between Cu and solder joint Speaker :Yoshihito Ii
Dates :Oct.09(Mon), 2023 - Oct.12(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Effect of Tafel Slope on the Difference Deposition Rate at 2CD(Circle Diameter) Wafer Speaker :Atsunobu Akita
Dates :Apr.19(Wed), 2023 - Apr.22(Sat), 2023
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Investigation of acidic pretreatment process with superior adhesion between Al material and electroless deposit Speaker :Takuma Maekawa
Dates :Feb.14(Tue), 2023 - Feb.16(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Solder/solder joint for low temperature reflow by multi plating method Speaker :Hiroki Nakano
Dates :Feb.14(Tue), 2023 - Feb.16(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of reliability using autocatalytic silver bath on ENEP layer Speaker :Naoshi Nishimura
Dates :Oct.31(Mon), 2022 - Nov.03(Thu), 2022
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAP Speaker :Shinichiro Yoshida
Dates :Oct.04(Tue), 2022 - Oct.06(Thu), 2022
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
Barrier Properties of Electroless CoWB Deposits under High Temperature Speaker :Tetsuya Sasamura
Dates :Sep.05(Mon), 2022 - Sep.07(Wed), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Solder/solder Joint for Low Temperature Reflow by Multi Plating Method Speaker :Yoichi Maruo
Dates :May.11(Wed), 2022 - May.13(Fri), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
The Investigation of filling performance for various size of through-hole on the additives of electrolytic copper plating Speaker :Ryo Manabe
Dates :Mar.23(Wed), 2022 - Mar.25(Fri), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Investigation of Pd-Ge alloy in ENEPIG process as better barrier layer Speaker :Yohei Kaneko
Dates :Nov.01(Mon), 2021 - Nov.04(Thu), 2021
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Oct.11(Mon), 2021 - Oct.14(Thu), 2021
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
The effect of the W concentration in the electroless Co-W-B bath to the deposits Speaker :Yoshihito Ii
Dates :Sep.20(Mon), 2021 - Sep.22(Wed), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Surface finishing for radio frequency applications Speaker :Naoshi Nishimura
Dates :Sep.06(Mon), 2021 - Sep.08(Wed), 2021
Organaizer :International Union for Surface Finishing (IUSF) /The Surface Finishing Society of Japan (SFJ)
Conference :INTERFINISH
Investigation of Factors Affecting Pillar Top Morphology and Height Uniformity Speaker :Naohide Akamatsu
Dates :Sep.06(Mon), 2021 - Sep.08(Wed), 2021
Organaizer :International Union for Surface Finishing (IUSF) /The Surface Finishing Society of Japan (SFJ)
Conference :INTERFINISH
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :May.12(Wed), 2021 - May.14(Fri), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Mar.17(Wed), 2021 - Mar.19(Fri), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Deposit properties of electroless Au/Pd/Au process for 5G application Speaker :Tetsuya Sasamura
Dates :Sep.28(Mon), 2020 - Oct.23(Fri), 2020
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Oct.13(Tue), 2020 - Oct.14(Wed), 2020
Organaizer :International Wafer-Level Packaging Conference
Conference :IWLPC
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity Speaker :Raihei Ikumoto
Dates :Oct.05(Mon), 2020 - Oct.08(Thu), 2020
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
The effect of B contents on structure and barrier properties of Co-W-B deposit Speaker :Yoshihito Ii
Dates :Sep.17(Thu), 2020 - Sep.18(Fri), 2020
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :Sep.22(Sun), 2019 - Sep.26(Thu), 2019
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of Barrier Properties of Electroless Co-W-B Deposited Film Speaker :Yoshihito Ii
Dates :Sep.12(Thu), 2019 - Sep.13(Fri), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Barrier properties of electroless deposit of Co-W-P alloy Speaker :Sho Kanzaki
Dates :Apr.17(Wed), 2019 - Apr.20(Sat), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :Mar.11(Mon), 2019 - Mar.13(Wed), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Evaluation of high speed plating for copper post with flat top shape and improved post height uniformity Speaker :Yuki Itakura
Dates :Oct.14(Sun), 2018 - Oct.18(Thu), 2018
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of barrier properties of electroless Co-W-P plating film Speaker :Sho Kanzaki
Dates :Sep.06(Thu), 2018 - Sep.07(Fri), 2018
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Characterization of Electro-less Copper Plating with Improved Plating Deposition in Via Hole Speaker :Masaharu Takeuchi
Dates :Mar.06(Tue), 2018 - Mar.08(Thu), 2018
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Deposit properties of new electroless Au/Pd/Au process for fine line application Speaker :Tatsushi Someya
Dates :Feb.05(Mon), 2018 - Feb.08(Thu), 2018
Organaizer :The Surface Mount Technology Association
Conference :SMTA Pan Pacific
Characteristics of new electroless Au/Pd/Au process for fine line application Speaker :Tetsuya Sasamura
Dates :Sep.17(Sun), 2017 - Sep.21(Thu), 2017
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Electromigration evaluation of ENEPIG (Electroless Ni/Pd/Au) deposit Speaker :Fuminori Shibayama
Dates :Aug.29(Tue), 2017 - Aug.30(Wed), 2017
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Electromigration evaluation of ENEPIG plating film Speaker :Tetsuya Sasamura
Dates :Sep.08(Thu), 2016 - Sep.09(Fri), 2016
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Factors Affecting Pillar Top Morphology and Height Uniformity on High Speed Copper Electroplating First author :Keita Taniguchi
Journal :The Surface Finishing Society of Japan
Volume :73,(7)
Pages :349-352
The solder Joint Reliability of Electroless Surface Finish for Diversified Electronic Components First author :Yukinori Oda
Journal :Japan Welding Society
Volume :91, (3)
Pages :181-185
Final Finishing for High Speed Data Communication First author :Shinsuke Wada
Journal :The Surface Finishing Society of Japan
Volume :72,(7)
Pages :377-380
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity First author :Raihei Ikumoto
Journal :Journal of Microelectronics and Electronic Packaging
Volume :18, (1)
Pages :7-11
Electroplating Equipment for Micro-Chip Components First author :Kouji Shimizu
Journal :The Surface Finishing Society of Japan
Volume :70,(10)
Pages :519-521
Behavior of Hydrogen in Electrolessly Deposited Ni/Au and Ni/Pd/Au Films First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :70,(3)
Pages :163-167
Influence of Hydrogen in Electrolessly Deposited Ni-P/Au Films on Solder Wettability First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :69,(9)
Pages :415-417
Hydrogen in Electrolessly Deposited Pure Pd and Pd-P Films First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :69,(7)
Pages :308-309
Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder First author :Yukinori Oda
Journal :Journal of Electronic Materials
Volume :47,(4)
Pages :2507-2511
Current Situation of Final Finish Focusing on Electroless Gold Bath First author :Tsuyoshi Maeda
Journal :The Surface Finishing Society of Japan
Volume :68,(9)
Pages :498-502
Auto-Chemical Controller and Analysis of Precious Metal Solution First author :Shinji Ishimaru
Journal :The Surface Finishing Society of Japan
Volume :67,(11)
Pages :572-574
Recent Trends of Electroless Copeer Plating First author :Tomoharu Nakayama
Journal :The Surface Finishing Society of Japan
Volume :66,(11)
Pages :496-498
Recent Trend of Electroless Palladium Plating First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :66,(10)
Pages :453-457
The Effect of Some Kinds of Final Finishing Deposit on Wire Bonding Reliability First author :Tatsushi Someya
Journal :The Surface Finishing Society of Japan
Volume :66,(2)
Pages :54-57