Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | The intermediate diffusion barrier performance of electroless Co-W-B / Ni-P stacked deposits between Cu and solder joint |
|---|---|
| Speaker | Yoshihito Ii |
| Dates | Oct.09(Mon), 2023 - Oct.12(Thu), 2023 |
| Organaizer | The Surface Mount Technology Association |
| Conference | SMTA International |