Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleInvestigation of the effects of various factors within steps of SAP process to nanovoids in the interface between electroless copper layer and inner layer copper by STEM analysis
SpeakerKanji Matsumoto
Dates Sep.30(Mon), 2024 - Oct.03(Thu), 2024
OrganaizerInternational Microelectronics Assembly & Packaging Society
ConferenceIMAPS

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