Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Barrier Properties of Electroless CoWB Deposits under High Temperature |
|---|---|
| Speaker | Tetsuya Sasamura |
| Dates | Sep.05(Mon), 2022 - Sep.07(Wed), 2022 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | MES |