Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleThe Investigation of filling performance for various size of through-hole on the additives of electrolytic copper plating
SpeakerRyo Manabe
Dates Mar.23(Wed), 2022 - Mar.25(Fri), 2022
OrganaizerThe Japan Institute of Electronics Packaging (JIEP)
ConferenceLecture meeting

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