Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | The Investigation of filling performance for various size of through-hole on the additives of electrolytic copper plating |
|---|---|
| Speaker | Ryo Manabe |
| Dates | Mar.23(Wed), 2022 - Mar.25(Fri), 2022 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | Lecture meeting |