Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAP |
|---|---|
| Speaker | Shinichiro Yoshida |
| Dates | Oct.04(Tue), 2022 - Oct.06(Thu), 2022 |
| Organaizer | International Microelectronics Assembly & Packaging Society |
| Conference | IMAPS |