Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleEvaluation of high speed plating for copper post with flat top shape and improved post height uniformity
SpeakerYuki Itakura
Dates Oct.14(Sun), 2018 - Oct.18(Thu), 2018
OrganaizerThe Surface Mount Technology Association
ConferenceSMTA International

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