Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Evaluation of high speed plating for copper post with flat top shape and improved post height uniformity |
|---|---|
| Speaker | Yuki Itakura |
| Dates | Oct.14(Sun), 2018 - Oct.18(Thu), 2018 |
| Organaizer | The Surface Mount Technology Association |
| Conference | SMTA International |