Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Solder/solder Joint for Low Temperature Reflow by Multi Plating Method |
|---|---|
| Speaker | Yoichi Maruo |
| Dates | May.11(Wed), 2022 - May.13(Fri), 2022 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | International Conference on Electronics Packaging (ICEP) |