Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Evaluation of barrier properties of electroless Co-W-P plating film |
|---|---|
| Speaker | Sho Kanzaki |
| Dates | Sep.06(Thu), 2018 - Sep.07(Fri), 2018 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | MES |