Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Characterization of Formaldehyde-free electro-less copper plating for SAP |
|---|---|
| Speaker | Masaharu Takeuchi |
| Dates | Mar.17(Wed), 2021 - Mar.19(Fri), 2021 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | Lecture meeting |