Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Barrier properties of electroless deposit of Co-W-P alloy |
|---|---|
| Speaker | Sho Kanzaki |
| Dates | Apr.17(Wed), 2019 - Apr.20(Sat), 2019 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | International Conference on Electronics Packaging (ICEP) |