Paper submission
A paper authored by an employee of C. Uyemura ＆ Co., Ltd. has been published in the following academic journal.
| Title | Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder |
|---|---|
| First author | Yukinori Oda |
| Journal | Journal of Electronic Materials |
| Volume | 47,(4) |
| Pages | 2507-2511 |