Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | ENEPES as an Effective Surface Finish for Enhancing Electromigration Reliability in Solder Joints |
|---|---|
| Speaker | Mai Odajima |
| Dates | May.26(Tue), 2026 - May.29(Fri), 2026 |
| Organaizer | IEEE |
| Conference | Electronic Components and Technologies Conference (ECTC) |