Paper submission

A paper authored by an employee of C. Uyemura & Co., Ltd. has been published in the following academic journal.

TitleOptimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
First authorRaihei Ikumoto
JournalJournal of Microelectronics and Electronic Packaging
Volume18, (1)

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