Paper submission
A paper authored by an employee of C. Uyemura ＆ Co., Ltd. has been published in the following academic journal.
| Title | Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity |
|---|---|
| First author | Raihei Ikumoto |
| Journal | Journal of Microelectronics and Electronic Packaging |
| Volume | 18, (1) |
| Pages | 7-11 |