Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleEvaluation of Barrier Properties of Electroless Co-W-B Deposited Film
SpeakerYoshihito Ii
Dates Sep.12(Thu), 2019 - Sep.13(Fri), 2019
OrganaizerThe Japan Institute of Electronics Packaging (JIEP)
ConferenceMES

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