Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Characterization of Electro-less Copper Plating with Improved Plating Deposition in Via Hole |
|---|---|
| Speaker | Masaharu Takeuchi |
| Dates | Mar.06(Tue), 2018 - Mar.08(Thu), 2018 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | Lecture meeting |