Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleCharacterization of Electro-less Copper Plating with Improved Plating Deposition in Via Hole
SpeakerMasaharu Takeuchi
Dates Mar.06(Tue), 2018 - Mar.08(Thu), 2018
OrganaizerThe Japan Institute of Electronics Packaging (JIEP)
ConferenceLecture meeting

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