Conference presentation
C. Uyemura & Co., Ltd. has presented at the following academic conference.
Title | Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity |
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Speaker | Raihei Ikumoto |
Dates | Oct.05(Mon), 2020 - Oct.08(Thu), 2020 |
Organaizer | International Microelectronics Assembly & Packaging Society |
Conference | IMAPS |