Conference presentation

C. Uyemura & Co., Ltd. has presented at the following academic conference.

TitleOptimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
SpeakerRaihei Ikumoto
Dates Oct.05(Mon), 2020 - Oct.08(Thu), 2020
OrganaizerInternational Microelectronics Assembly & Packaging Society
ConferenceIMAPS

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