Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity |
|---|---|
| Speaker | Takuya Komeda |
| Dates | May.12(Wed), 2021 - May.14(Fri), 2021 |
| Organaizer | The Japan Institute of Electronics Packaging (JIEP) |
| Conference | International Conference on Electronics Packaging (ICEP) |