R&D Activities
Conferences
Solder joint reliability of middle P% and high P% Ni/Au with low melting point solder containing Indium Speaker :Mutsumi Komeyama
Dates : Oct.19(Sun), 2025 - Oct.23(Thu), 2025
Organaizer : The Surface Mount Technology Association
Conference : SMTA International
Conferences
Electrolytic copper plating process for glass substrate Speaker :Raihei Ikumoto
Dates : May.27(Tue), 2025 - May.30(Fri), 2025
Organaizer : IEEE
Conference : Electronic Components and Technologies Conference (ECTC)
Past Activities
Investigation of the effects of various factors within steps of SAP process to nanovoids in the interface between electroless copper layer and inner layer copper by STEM analysis Speaker :Kanji Matsumoto
Dates :Sep.30(Mon), 2024 - Oct.03(Thu), 2024
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
The intermediate diffusion barrier performance of electroless Co-W-B / Ni-P stacked deposits between Cu and solder joint Speaker :Yoshihito Ii
Dates :Oct.09(Mon), 2023 - Oct.12(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Effect of Tafel Slope on the Difference Deposition Rate at 2CD(Circle Diameter) Wafer Speaker :Atsunobu Akita
Dates :Apr.19(Wed), 2023 - Apr.22(Sat), 2023
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Investigation of acidic pretreatment process with superior adhesion between Al material and electroless deposit Speaker :Takuma Maekawa
Dates :Feb.14(Tue), 2023 - Feb.16(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Solder/solder joint for low temperature reflow by multi plating method Speaker :Hiroki Nakano
Dates :Feb.14(Tue), 2023 - Feb.16(Thu), 2023
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of reliability using autocatalytic silver bath on ENEP layer Speaker :Naoshi Nishimura
Dates :Oct.31(Mon), 2022 - Nov.03(Thu), 2022
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAP Speaker :Shinichiro Yoshida
Dates :Oct.04(Tue), 2022 - Oct.06(Thu), 2022
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
Barrier Properties of Electroless CoWB Deposits under High Temperature Speaker :Tetsuya Sasamura
Dates :Sep.05(Mon), 2022 - Sep.07(Wed), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Solder/solder Joint for Low Temperature Reflow by Multi Plating Method Speaker :Yoichi Maruo
Dates :May.11(Wed), 2022 - May.13(Fri), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
The Investigation of filling performance for various size of through-hole on the additives of electrolytic copper plating Speaker :Ryo Manabe
Dates :Mar.23(Wed), 2022 - Mar.25(Fri), 2022
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Investigation of Pd-Ge alloy in ENEPIG process as better barrier layer Speaker :Yohei Kaneko
Dates :Nov.01(Mon), 2021 - Nov.04(Thu), 2021
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Oct.11(Mon), 2021 - Oct.14(Thu), 2021
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
The effect of the W concentration in the electroless Co-W-B bath to the deposits Speaker :Yoshihito Ii
Dates :Sep.20(Mon), 2021 - Sep.22(Wed), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Investigation of Factors Affecting Pillar Top Morphology and Height Uniformity Speaker :Naohide Akamatsu
Dates :Sep.06(Mon), 2021 - Sep.08(Wed), 2021
Organaizer :International Union for Surface Finishing (IUSF) /The Surface Finishing Society of Japan (SFJ)
Conference :INTERFINISH
Surface finishing for radio frequency applications Speaker :Naoshi Nishimura
Dates :Sep.06(Mon), 2021 - Sep.08(Wed), 2021
Organaizer :International Union for Surface Finishing (IUSF) /The Surface Finishing Society of Japan (SFJ)
Conference :INTERFINISH
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :May.12(Wed), 2021 - May.14(Fri), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Mar.17(Wed), 2021 - Mar.19(Fri), 2021
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Deposit properties of electroless Au/Pd/Au process for 5G application Speaker :Tetsuya Sasamura
Dates :Sep.28(Mon), 2020 - Oct.23(Fri), 2020
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Characterization of Formaldehyde-free electro-less copper plating for SAP Speaker :Masaharu Takeuchi
Dates :Oct.13(Tue), 2020 - Oct.14(Wed), 2020
Organaizer :International Wafer-Level Packaging Conference
Conference :IWLPC
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity Speaker :Raihei Ikumoto
Dates :Oct.05(Mon), 2020 - Oct.08(Thu), 2020
Organaizer :International Microelectronics Assembly & Packaging Society
Conference :IMAPS
The effect of B contents on structure and barrier properties of Co-W-B deposit Speaker :Yoshihito Ii
Dates :Sep.17(Thu), 2020 - Sep.18(Fri), 2020
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :Sep.22(Sun), 2019 - Sep.26(Thu), 2019
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of Barrier Properties of Electroless Co-W-B Deposited Film Speaker :Yoshihito Ii
Dates :Sep.12(Thu), 2019 - Sep.13(Fri), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Barrier properties of electroless deposit of Co-W-P alloy Speaker :Sho Kanzaki
Dates :Apr.17(Wed), 2019 - Apr.20(Sat), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :International Conference on Electronics Packaging (ICEP)
Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Speaker :Takuya Komeda
Dates :Mar.11(Mon), 2019 - Mar.13(Wed), 2019
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Evaluation of high speed plating for copper post with flat top shape and improved post height uniformity Speaker :Yuki Itakura
Dates :Oct.14(Sun), 2018 - Oct.18(Thu), 2018
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Evaluation of barrier properties of electroless Co-W-P plating film Speaker :Sho Kanzaki
Dates :Sep.06(Thu), 2018 - Sep.07(Fri), 2018
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Characterization of Electro-less Copper Plating with Improved Plating Deposition in Via Hole Speaker :Masaharu Takeuchi
Dates :Mar.06(Tue), 2018 - Mar.08(Thu), 2018
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :Lecture meeting
Deposit properties of new electroless Au/Pd/Au process for fine line application Speaker :Tatsushi Someya
Dates :Feb.05(Mon), 2018 - Feb.08(Thu), 2018
Organaizer :The Surface Mount Technology Association
Conference :SMTA Pan Pacific
Characteristics of new electroless Au/Pd/Au process for fine line application Speaker :Tetsuya Sasamura
Dates :Sep.17(Sun), 2017 - Sep.21(Thu), 2017
Organaizer :The Surface Mount Technology Association
Conference :SMTA International
Electromigration evaluation of ENEPIG (Electroless Ni/Pd/Au) deposit Speaker :Fuminori Shibayama
Dates :Aug.29(Tue), 2017 - Aug.30(Wed), 2017
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Electromigration evaluation of ENEPIG plating film Speaker :Tetsuya Sasamura
Dates :Sep.08(Thu), 2016 - Sep.09(Fri), 2016
Organaizer :The Japan Institute of Electronics Packaging (JIEP)
Conference :MES
Consideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias First author :Atsunobu Tanimoto
Journal :The Surface Finishing Society of Japan
Volume :75,(11)
Pages :517-520
Factors Affecting Pillar Top Morphology and Height Uniformity on High Speed Copper Electroplating First author :Keita Taniguchi
Journal :The Surface Finishing Society of Japan
Volume :73,(7)
Pages :349-352
The solder Joint Reliability of Electroless Surface Finish for Diversified Electronic Components First author :Yukinori Oda
Journal :Japan Welding Society
Volume :91, (3)
Pages :181-185
Final Finishing for High Speed Data Communication First author :Shinsuke Wada
Journal :The Surface Finishing Society of Japan
Volume :72,(7)
Pages :377-380
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity First author :Raihei Ikumoto
Journal :Journal of Microelectronics and Electronic Packaging
Volume :18, (1)
Pages :7-11
Electroplating Equipment for Micro-Chip Components First author :Kouji Shimizu
Journal :The Surface Finishing Society of Japan
Volume :70,(10)
Pages :519-521
Behavior of Hydrogen in Electrolessly Deposited Ni/Au and Ni/Pd/Au Films First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :70,(3)
Pages :163-167
Influence of Hydrogen in Electrolessly Deposited Ni-P/Au Films on Solder Wettability First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :69,(9)
Pages :415-417
Hydrogen in Electrolessly Deposited Pure Pd and Pd-P Films First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :69,(7)
Pages :308-309
Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder First author :Yukinori Oda
Journal :Journal of Electronic Materials
Volume :47,(4)
Pages :2507-2511
Current Situation of Final Finish Focusing on Electroless Gold Bath First author :Tsuyoshi Maeda
Journal :The Surface Finishing Society of Japan
Volume :68,(9)
Pages :498-502
Auto-Chemical Controller and Analysis of Precious Metal Solution First author :Shinji Ishimaru
Journal :The Surface Finishing Society of Japan
Volume :67,(11)
Pages :572-574
Recent Trends of Electroless Copeer Plating First author :Tomoharu Nakayama
Journal :The Surface Finishing Society of Japan
Volume :66,(11)
Pages :496-498
Recent Trend of Electroless Palladium Plating First author :Yukinori Oda
Journal :The Surface Finishing Society of Japan
Volume :66,(10)
Pages :453-457
The Effect of Some Kinds of Final Finishing Deposit on Wire Bonding Reliability First author :Tatsushi Someya
Journal :The Surface Finishing Society of Japan
Volume :66,(2)
Pages :54-57