Paper submission

A paper authored by an employee of C. Uyemura & Co., Ltd. has been published in the following academic journal.

TitleConsideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias
First authorAtsunobu Tanimoto
JournalThe Surface Finishing Society of Japan
Volume75,(11)
Pages517-520

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