社外講演のお知らせ（Solder joint reliability of middle P% and high P% Ni/Au with low melting point solder containing Indium） 2025.10.24研究開発
社外講演のお知らせ（Investigation of the effects of various factors within steps of SAP process to nanovoids in the interface between electroless copper layer and inner layer copper by STEM analysis） 2024.10.04研究開発
社外講演のお知らせ（The intermediate diffusion barrier performance of electroless Co-W-B / Ni-P stacked deposits between Cu and solder joint） 2023.10.13研究開発
