Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Investigation of the effects of various factors within steps of SAP process to nanovoids in the interface between electroless copper layer and inner layer copper by STEM analysis |
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| Speaker | Kanji Matsumoto |
| Dates | Sep.30(Mon), 2024 - Oct.03(Thu), 2024 |
| Organaizer | International Microelectronics Assembly & Packaging Society |
| Conference | IMAPS |