Our History

Commenced business in Doshomachi, Osaka

The predecessor of C.Uyemura & Co., Ltd., operated under the trade name “SANUKIYA”. The starting point for our company was a store specializing in business selling traditional Japanese and Chinese medicines in 1848 in Doshomachi, Osaka, which was the center of the medicines trade in Japan.

Medicine wholesale district in Doshomachi

Medicine wholesale district in Doshomachi

Succeeded in domestic production of Oily abrasive compounds

After World War I, the government announced a policy of encouraging domestic production in order to break the dependence on foreign countries. Taking that opportunity, Chobei Uyemura VI carried out research for the domestic production of polishing compounds, for which Japan previously relied on imports. In 1918, the company succeeded in the domestic production of oily abrasive compounds and began manufacturing them.

Oily abrasive compound

Oily abrasive compound

Incorporated as a joint-stock company named C.Uyemura & Co., Ltd.

C. Uyemura & Co., Ltd. was established with capital of 500,000 yen, so our company changed from being a privately owned store to being a modern company organization. Chobei Uyemura VI became the first company president.

Chobei Uyemura VI

Chobei Uyemura VI

Establishment of a specialty plating chemical department

Promoted full-scale research on plating technology and worked on the development of chemicals such as brighteners. Eventually succeeded in developing original products such as the “ASAHI COPPENER” brightener for copper cyanide plating and “ASAHI RIGHT” for bright nickel plating.

The “Asahi mark” trademark of our company products

The “Asahi mark” trademark of our company products

Establishment of a plating equipment department

Started the planning and design of various plating equipment, including automatic plating equipment. As an addition to abrasive compounds and chemicals, the creation of a plating equipment department secured a new major pillar for the products of the company, and it established the company as an all-round manufacturer of plating products.

Scene of automatic machine assembly

Scene of automatic machine assembly

Established Sanwa Bosei Co., Ltd.
(now Sumix Corporation) as a plating company

A joint venture company, Sanwa Bosei Co., Ltd. (now Sumix Corporation), was established in Osaka, as a factory to check the usage conditions for the users of the products developed in our company, before those products were put on the market.

Headquarters factory when Sanwa Bosei Co., Ltd. was established

Sanwa Bosei Co., Ltd. at the time of establishment

Launch of “The Robot Compact”
fully automatic programmed plating system

In order to diversify our machinery and equipment technology, we introduced “The Robot Compact (Fully automatic programmed plating system)” ahead of the industry. This was the predecessor of the UF Carrier, which had a long track record that continued to this day.

The Robot Compact

The Robot Compact

Completed the Chemical Plant and the Central Research Laboratory

The Chemical Plant and the Central Research Laboratory were completed in the grounds of the current Hirakata Plant. From that time, the Central Research Laboratory was the most advanced research institute in the industry, with a lineup of advanced instruments and equipment such as scanning electron microscopes and X-ray analysis equipment.

Hirakata Plant around 1978

Hirakata Plant around 1978

Launch of “NIMUDEN” electroless nickel plating solution

With “NIMUDEN 5X”, the long-term continuous use of electroless nickel plating was established for the first time in Japan. Furthermore, the solid position of the company in the plating industry was established with the preparation of “NIMUDEN DX” as a version with improved corrosion resistance.

Launch of NIMUDEN electroless nickel plating solution

Launch of “NIMCON” automatic control systems for electroless nickel plating

As the demand for the functional characteristics of electroless nickel plating deposits became more evident, our company’s “NIMCON” was installed on a large number of production lines. This automated the analysis and replenishment and helped to secure deposits with a constant thickness and constant quality.

NIMCON

NIMCON

Launch of the “CHEMiROBO” automatic general-purpose plating-liquid control system

The “CHEMiROBO” general-purpose control systems were launched with the ability to handle various plating and pretreatment liquids through the installation of a microcomputer in the control section and the incorporation of analysis mechanisms as needed.

CHEMiROBO

CHEMiROBO

Launch of “NIMUDEN HDX” electroless nickel plating solution for hard disks

As IT advanced, the demand for higher density aluminum magnetic disks also increased. The pretreatment method “AD Process” and electroless nickel plating solution “NIMUDEN HDX” were developed for hard disks. The Science and Technology Agency Director-General’s Prize was received in 1996 for the development of a hard disk substrate layer forming technology using electroless plating.

Launch of NIMUDEN HDX electroless nickel plating solution for hard disks

Established Uyemura International Corporation in the United States

After establishing the joint venture company Uyemura International Corporation (UIC), in Los Angeles, USA, the company went on to expand its business globally, centering on the Asian region.

U.S. office when it was established

U.S. office at the time of establishment

Developed “NIMUFLON” electroless Ni/PTFE composite plating solution

The successful development of composite plating technology was achieved in 1980 and this attracted attention from various fields. The “NIMUFLON” composite plating solution developed in 1989 combines excellent mass productivity and coating properties. It quickly spread to a wide range of general-purpose products such as automobiles, motorcycles, IT products and home appliances.

無電解ニッケル/PTFE複合めっき液「ニムフロン」開発

Launched “STARLiNE-DASH” control systems

The simple “STARLiNE-DASH NP” control systems were launched with functions limited to analysis and replenishment. Together with the “CHEMiROBO” series, this created a system to be able to supply the equipment to meet the needs of users for electroless nickel plating control systems, and was adopted in many plating workplaces.

STARLiNE-DASH NP

STARLiNE-DASH NP

Developed “Ucon” vertical transfer plating system for printed circuit boards

The “Ucon” was developed as a plating system that fixed the lower part of printed circuit boards and transferred them vertically and continuously without the use of jigs. This made it possible to reduce maintenance work and improve the uniformity of the plating deposit thickness.

Ucon

Ucon

Developed “KAT Process” for final finish process

The “KAT Process” was developed to cope with higher density printed circuit boards. This in turn led to the development of our company’s flagship final finish process (electroless nickel-gold plating).

Developed KAT Process for final finish process

Developed “FLOW-THROUGH PLATER RP-1” plating equipment for small parts

The “FLOW-THROUGH PLATER RP-1” plating equipment for small parts was developed based on a new concept that made anything up to fine powder plating possible.

FLOW-THROUGH PLATER RP-1

FLOW-THROUGH PLATER RP-1

Listed on the Second Section of the Osaka Securities Exchange

On November 21, 1997, our company listed its shares on the Second Section of the Osaka Securities Exchange. In 2013, the company was listed on the Second Section of the Tokyo Stock Exchange, following the merger of the Tokyo Stock Exchange and the Osaka Securities Exchange.

Listed on the Second Section of the Osaka Securities Exchange

Developed the “THRU-CUP PEA” electroless copper plating solution

The “THRU-CUP PEA” electroless copper plating solution for build-up substrates was developed in 1998 for build-up substrates with insulating resin blind via holes (BVH) made by laser beam machining, which was attracting attention at that time. It received favorable evaluations for the low stress deposit and the high reliability provided by the throwing ability to the inside of the BVH.

Developed the THRU-CUP PEA electroless copper plating solution

Opened the Technical Center in the United States

The Technical Center was opened in Connecticut, U.S.A. It has presented a large number of research results at conferences attended by world-class companies and engineers, and plays an important role as a contact point with global IT companies.

Technical Center

U.S. Technical Center

Developed “SOFTALLOY GTC” lead-free solder plating solution

The development of products in response to various environmental regulations progressed rapidly from the 1990s, against the background of increasing interest in environmental problems. Our company began the development of a lead-free solder plating solution in 1995 and the “SOFTALLOY GTC” developed in 1999 was used in a wide range of applications, including semiconductor lead frames and chip components.

Developed SOFTALLOY GTC lead-free solder plating solution

Developed “EPITHAS Process” for wafers

The “EPITHAS Process” was developed as a UBM (Under Bump Metallization) formation process for aluminum electrodes on silicon wafers.

Developed EPITHAS Process for wafers

Developed the “THRU-CUP EVF-R” electrolytic copper plating solution

In the latter half of the 1990s, electrolytic copper plating solution for via filling appeared in the industry. In 2004, our company developed the “THRU-CUP EVF-R” for panel plating. It was the product that became the base for the EVF series, which were currently our main product for electrolytic copper plating for via filling.

Developed the THRU-CUP EVF-R electrolytic copper plating solution

Established Taiwan Research Laboratory (TRL)

The Taiwan Research Laboratory (TRL) was established in 2005 to respond to the state-of-the-art companies in the Taiwan market. It also conducts joint research with universities in Taiwan and provides technical support to Taiwanese companies advancing into the Chinese continent.

Taiwan Research Laboratory (TRL)

Taiwan Research Laboratory (TRL)

Completed a three-year plan for the modernization of the Hirakata Plant

The aging buildings at the Hirakata Plant were rebuilt and the plant was modernized to increase its production capacity.

Chemical Plant and raw materials warehouse

Chemical Plant and raw materials warehouse

Developed “U-VCPS” vertical transfer continuous plating system

The “U-VCPS” fully automatic vertical transfer continuous plating system with no up-down mechanism was developed for printed circuit boards. Its unique circulation system realized efficient mass transfer and enabled improved plating deposition.

U-VCPS

U-VCPS

Completed construction of a new building for the Central Research Laboratory

This was a reconstruction of the former Central Research Laboratory, and was completed with the aim of encouraging researchers to think creatively. It is an environmentally-symbiotic laboratory that has been designed with consideration for the surrounding environment. It received an S rank in the “Osaka Prefecture CASBEE (Osaka Prefecture environmental performance indication for buildings)”.

Central Research Laboratory

Central Research Laboratory

Development of “SpeedPlater UBM” plating system for UBM

The “SpeedPlater UBM” equipment was developed for the main purpose of forming UBM by electroless plating on the mounting pad electrodes on semiconductor wafers.

SpeedPlater UBM

SpeedPlater UBM