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Conference presentation（Deposit properties of new electroless Au/Pd/Au process for fine line application）

R&D

[Ended]Notice of Exhibit at 19th IC & Sensor Packaging Technology EXPO（ISP 2018）

Events

Paper submission（Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder）

R&D

[Ended]Notice of Exhibit at HKPCA 2017

Events

Interim Results of Operations(April 1, 2017-September 30, 2017)

IR

[Ended]Notice of Exhibit at SFCHINA 2017

Events

Consolidated Financial Results for the Second Quarter of the Fiscal Year Ending March 31, 2018 (Six Months Ended September 30, 2017)

IR

[Ended]Notice of Exhibit at TPCA Show 2017

Events

Conference presentation（Characteristics of new electroless Au/Pd/Au process for fine line application）

R&D

[Ended]Notice of Exhibit at SEMICON Taiwan 2017

Events

Paper submission（Current Situation of Final Finish Focusing on Electroless Gold Bath）

R&D

Conference presentation（Electromigration evaluation of ENEPIG (Electroless Ni/Pd/Au) deposit）

R&D