Package boards
Desmear electroless copper plating pretreatment
Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP
APPDES Process / ALCUP Process
Pickup Products
Category
- Electronic circuit boards
- Electronic circuit boards
Printed wiring boards rigidDirect platingDirect Plating Process for FPC and RF
PALLADIGM Process
- Electronic circuit boards
Printed wiring boards flexibleEnig electroless nickle immersion goldElectroless Ni/Au Process for Flexible Application
NIMUDEN NPG-1(ver.MT), GOBRIGHT TLM-44, NANOSEALER MSL-17
- Electronic circuit boards
Package boardsElectrolytic tin platingElectrolytic Tin Bump for Flip Chip Packaging
ELSTANNER GKH-66 (conformal bath)
- Electronic circuit boards
Plating solution control systemsElectroless Nickel Plating Solution Controller
STARLiNE-DASH 4 NP
- Electronic circuit boards
Plating solution control systemsElectrolytic Gold Plating Solution Controller
CHEMiROBO 3 EAU
- Electronic circuit boards
Plating equipmentNew Type Vertical Continuous Plating System
U-VCPS
- Electronic circuit boards
Printed wiring boards rigidIgepig immersion gold electroless palladium immersion goldElectroless Au/Pd/Au Process (IGEPIG)
(Immersion Gold / Electroless Palladium / Immersion Gold)
- Electronic circuit boardsPackage boardsIgepig immersion gold electroless palladium immersion gold
Electroless Au/Pd/Au Process (IGEPIG)
(Immersion Gold / Electroless Palladium / Immersion Gold)
- Electronic circuit boards
Printed wiring boards rigidElectroless gold platingMixed Reaction Type Electroless Gold Bath for Ni/Pd/Au Process （ENEPIG）
GOBRIGHT TNK-24
- Electronic circuit boardsPackage boardsElectroless gold plating
Mixed Reaction Type Electroless Gold Bath for Ni/Pd/Au Process （ENEPIG）
GOBRIGHT TNK-24
- Electronic circuit boards
Printed wiring boards rigidElectroless gold platingCyanide-free Electroless Gold Bath
GOBRIGHT TNC-25 / TNC-47
- Electronic circuit boardsPackage boardsElectroless gold plating
Cyanide-free Electroless Gold Bath
GOBRIGHT TNC-25 / TNC-47
- Electronic circuit boards
Printed wiring boards rigidElectroless palladium platingElectroless Palladium Bath for Ni/Pd/Au Process（ENEPIG）
Pd-P: ALTAREA TPD-35 / Pure Pd: ALTAREA TPD-23
- Electronic circuit boardsPackage boardsElectroless palladium plating
Electroless Palladium Bath for Ni/Pd/Au Process（ENEPIG）
Pd-P: ALTAREA TPD-35 / Pure Pd: ALTAREA TPD-23
- Electronic circuit boards
Printed wiring boards rigidFinal finish pretreatmentPretreatment Process for Fine Pattern
- Electronic circuit boardsPackage boardsFinal finish pretreatment
Pretreatment Process for Fine Pattern
- Electronic circuit boards
Package boardsElectrolytic copper platingAdditive for Electrolytic Copper Plating Post Plating for FO-PLP
THRU-CUP EST-01
- Electronic circuit boards
Printed wiring boards rigidElectrolytic copper platingAdditive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern
THRU-CUP EVF-YF7 / EVF-YF9
- Electronic circuit boardsPackage boardsElectrolytic copper plating
Additive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern
THRU-CUP EVF-YF7 / EVF-YF9
- Electronic circuit boards
Package boardsElectrolytic copper platingAdditive for Electrolytic Copper Plating for Fine Pattern
THRU-CUP EMB-02
- Electronic circuit boards
Printed wiring boards rigidElectroless copper platingElectroless Copper Plating with Excellent Coverage in BVH
THRU-CUP PTU
- Electronic circuit boardsPackage boardsElectroless copper plating
Electroless Copper Plating with Excellent Coverage in BVH
THRU-CUP PTU
- Electronic circuit boards
Package boardsElectroless copper platingElectroless Copper Plating for Fine Pattern SAP
THRU-CUP PEAV6
- Electronic circuit boardsPrinted wiring boards rigidDesmear electroless copper plating pretreatment
Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP
APPDES Process / ALCUP Process
- Electronic circuit boardsPrinted wiring boards flexibleDirect plating printed wiring boards flexible
Direct Plating Process for FPC and RF
PALLADIGM Process
- Electronic circuit boards
Package boardsDirect platingDirect Plating Process for FPC and RF
PALLADIGM Process
- Semiconductors
Plating solution control systemsPrecious Metal Plating Solution Controllers
Solution Controllers for Electroless Pd and Electroless Au
- Semiconductors
Plating solution control systemsWafer Process Solution Controllers
CHEMiROBO 3 & STARLiNE-DASH 4 NP
- Semiconductors
Plating equipmentPlating System for UBM / PLP
SpeedPlater
- Semiconductors
Power deviceNext generation power modulePlating Process for Next Generation Power Module
- Semiconductors
Power deviceElectroless silver platingAutocatalytic Electroless Silver Plating Bath
EPITHAS RSL-34
- Semiconductors
Power deviceElectroless nickel platingLow Phosphorus Electroless Nickel Bath
EPITHAS NLL-1
- Semiconductors
Power deviceUbm forming processPlating Process for Power Device
UBM Forming Process on Al Pad
- Semiconductors
Power deviceUbm forming processUBM Forming Process on Al or Cu Pad
EPITHAS Process
- Semiconductors
Logic memoryElectrolytic sn ag alloy platingElectrolytic Sn-Ag Alloy Process for Wafer Bumping
EPITHAS GRD-3
- Semiconductors
Logic memoryElectrolytic copper platingAdditive for Electrolytic Copper Plating for Pattern Via Filling
EPITHAS EHK-09
- Semiconductors
Logic memoryElectrolytic copper platingAdditive for Electrolytic Copper RDL Plating
EPITHAS EDL-02
- Semiconductors
Logic memoryElectrolytic copper platingAdditive for Electrolytic Copper Post Plating
EPITHAS EPT-H
- Semiconductors
Logic memoryPretreatmentTitanium Alloy Etching Solution for Barrier Metal
EPITHAS MXB-4
- Electronic componentsPower device electronic componentsNext generation power module
Plating Process for Next Generation Power Module
- Electronic components
Passive deviceElectrolytic nickel tin platingNickel / Neutral Tin Plating Process for Chip Parts
- Electronic components
ConnectorElectrolytic silver platingCyanide-free Electrolytic Silver Plating Process
SURPLEA GPS Process
- Functional platingPlating solution control systems
Electroless Nickel Plating Solution Controller
STARLiNE-DASH 4 NP
- Functional plating
Nickel platingFor aluminum substrateElectroless Ni-P Process with Excellent Joint Reliability on Al Substrate
NIMUDEN ZINCATE LEA-10, NIMUDEN KSL
- Functional plating
Nickel platingBlackening depositPb-free Electroless Ni-P Plating Bath for Excellent Blackening Deposit
NIMUDEN BLACK KMC-3 & KJB-2
- Functional plating
Nickel platingTernary alloy typeElectroless Ni-Co-P Plating Bath for Excellent Wear Resistance
TRIALLOY KKR
- Functional plating
Nickel platingVarious characteristicsElectroless Ni-P Plating Bath for Suppressing Crack Generation After Bending Process
NIMUDEN KLT
- Functional plating
Nickel platingVarious characteristicsLow Phosphorus Electroless Ni-P Plating Bath with Excellent Solderability
NIMUDEN KSL
- Functional plating
Nickel platingVarious characteristicsElectroless Ni-P Plating Bath for High Hardness & Low Phosphorus Applications
NIMUDEN KHN-2
- Functional plating
Nickel platingVarious characteristicsElectroless Ni-P Plating Bath for Excellent Corrosion Resistance and Thicker Deposit
NIMUDEN KFJ-20 ver.S & ver.TL
- Functional plating
Composite platingElectroless Ni-P / PTFE Composite Plating
NIMUFLON & NIMUFLON FUL - Type JB-
- Functional plating
PretreatmentFor aluminum substrate pretreatmentZincate Bath for Excellent Adhesion on Al Substrate
NIMUDEN ZINCATE LEA-10