TOP
About Us
Products and R&D
Sustainability
Investors
Dr. UYEMURA's Room
Contact Us

- English
- 日本語
- 한국어
- 简体中文
- 繁體中文
Contact Us

About Us

Company Information
Message from the President
News & Topics
Location
Our History
Our Business
Video Library

Products and R&D

R&D System
R&D Activities
Model Plant
Our Products
Events

Sustainability

Uyemura Group slogan
Approaches to ESG & SDGs
TCFD handling
Initiatives to Decarbonize
CSR

Investors

IR TOP
Message from the President
IR Library
Mid-Term Business Plan
shareholder meeting
Disclosure Policy

R&D System
R&D Activities
Model Plant
Our Products
Events

TOP > Pickup Products > Electrolytic Tin Bump for Flip Chip Packaging

Pickup Products

Electrolytic Tin Bump for Flip Chip Packaging

ELSTANNER GKH-66 (conformal bath)

electronic circuit boards

Package boards

About Us

Company Information
Message from the President
News & Topics
Location
Our History
Our Business
Video Library

Products and R&D

R&D System
R&D Activities
Model Plant
Our Products
Events

Sustainability

Uyemura Group slogan
Approaches to ESG & SDGs
Initiatives to Decarbonize
CSR

Investors

IR TOP
Message from the President
IR Library
Mid-Term Business Plan
Disclosure Policy
Stock Information (Japanese)

Dr. UYEMURA's Room

Dr. UYEMURA's Room
The Story of Plating Episode
History of the plating industry (Japanese)

Site Map
Contact Us
Privacy Policy
Terms for Use

Copyright © C. Uyemura ＆ Co., Ltd. All rights reserved.