Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Solder/solder joint for low temperature reflow by multi plating method |
|---|---|
| Speaker | Hiroki Nakano |
| Dates | Feb.14(Tue), 2023 - Feb.16(Thu), 2023 |
| Organaizer | The Surface Mount Technology Association |
| Conference | SMTA International |