Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Characterization of Formaldehyde-free electro-less copper plating for SAP |
|---|---|
| Speaker | Masaharu Takeuchi |
| Dates | Oct.13(Tue), 2020 - Oct.14(Wed), 2020 |
| Organaizer | International Wafer-Level Packaging Conference |
| Conference | IWLPC |