Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | The Effect of Ni Content in Electroless Cu Deposit on the Adhesion Between the Seed Layer and Glass Substrate |
|---|---|
| Speaker | Kanji Matsumoto |
| Dates | Sep.28(Mon), 2026 - Oct.01(Thu), 2026 |
| Organaizer | International Microelectronics Assembly & Packaging Society |
| Conference | IMAPS |