JPCA Show 2024
C. Uyemura ＆ Co., Ltd. will be exhibiting at JPCA Show 2024. We are looking forward to seeing you at our booth.
| Dates | Jun.12(Wed), 2024 - Jun.14(Fri), 2024 10:00～17:00 |
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| Venue | Tokyo Big Sight |
| Booth number | East hall 5, 5F-12 |
| Exhibited products | 【Plating Chemicals and Equipment Ensuring Next Generation High Density Circuit Technology】 ・Electroless Copper Pretreatment for SAP New ALCUP Process ・Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP MUP Process ・Electroless Copper Plating for Fine Pattern SAP THRU-CUP PEAV6 ・Electroless Copper Plating with Excellent Coverage in BVH THRU-CUP PTU ・Additive for Electrolytic Copper Plating for Fine Pattern THRU-CUP EMB-02 ・Additive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern THRU-CUP EVF-YF7 / EVF-YF9 ・Additive for Electrolytic Copper Plating Post Plating for FO-PLP THRU-CUP EST-01 ・Additive for Electrolytic Copper Plating for FC-BGA THRU-CUP ETV-13 ・Additive for Periodic Pulse Reverse (PPR) Copper Plating for Conformal Through-Hole THRU-CUP ECP-01 ＜NEW＞ ・Electrolytic Cu / Ni / Sn Process for Bump Forming ・MOSL and Electroless Copper Plating Process on Glass Panel 【Plating Chemicals Ensuring High Reliability for Flexible Substrate】 ・Direct Plating Process for FPC and RF PALLADIGM Process 【Plating Chemicals and Equipment Ensuring the Diversifying Mounting Technology】 ・Cyanide-free Electroless Gold Bath for ENEPIG GOBRIGHT TNC-48 ・Electroless Pd Bath for Ni/Pd/Au Process (ENEPIG) Pd-P: ALTAREA TPD-35 Pure Pd: ALTAREA TPD-23 ・Electroless Au/Pd/Au Process (IGEPIG) ・Electroless Silver Bath for Ag Sinter Joint Reliability PRESA RST-29 & ARJENTE RSD-4 (ver. MT2) ・Automation Solution Controller for All Processes CHEMiROBO 3 & STARLiNE-DASH 4 NP ・Cyanide-free Pd Removal Process NANOMOVER LSK-5 & ACCEMULTA WSN-6 ・Pretreatment Process for Fine Pattern 【NPI Presentation】 ・Date: June 13 (Thu) 11:05 to 11:25 ・Venue: East Hall 3 - Seminar Venue D (Entrance free of charge) ・Title：Electrolytic copper plating bath for high density penetrate through hole core board 【Presentations in the booth】 ・June 12 (Wed), 13 (Thu), 14 (Fri)： 「MOSL and Electroless Copper Plating Process on Glass Panel」 ・June 12 (Wed)： 「Additive for Electrolytic Copper Plating for FC-BGA THRU-CUP ETV-13」 ・June 13 (Thu)： 「Additive for Periodic Pulse Reverse (PPR) Copper Plating for Conformal Through-Hole THRU-CUP ECP-01」 ・June 14 (Fri)： 「Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP MUP Process」 |
| Official website | https://www.jpcashow.com/show2024/en/index.html |