25th IC & Sensor Packaging EXPO（ISP 2024）
C. Uyemura ＆ Co., Ltd. will be exhibiting at 25th IC & Sensor Packaging EXPO（ISP 2024）. We are looking forward to seeing you at our booth.
| Dates | Jan.24(Wed), 2024 - Jan.26(Fri), 2024 10:00～17:00 |
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| Venue | Tokyo Big Sight |
| Booth number | East hall 4, 32-47 |
| Exhibited products | 【Wafer Plating Processes】 ・UBM Forming Process on Al or Cu Pad EPITHAS Process ・Additive for Electrolytic Copper Post Plating EPITHAS EPT-H ・Additive for Electrolytic Copper RDL Plating EPITHAS EDL-02 ・Electrolytic Cu / Ni / Sn-Ag Alloy process for Wafer Bumping 【Package Substrate Plating Processes】 ・Electroless Copper Pretreatment for SAP New ALCUP Process ・Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP MUP Process ・Electroless Copper Plating for Fine Pattern SAP THRU-CUP PEAV6 ・Electroless Copper Plating with Excellent Coverage in BVH THRU-CUP PTU ・Additive for Electrolytic Copper Plating for Fine Pattern THRU-CUP EMB-02 ・Additive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern THRU-CUP EVF-YF7 / EVF-YF9 ・Additive for Electrolytic Copper Plating Post Plating for FO-PLP THRU-CUP EST-01 ・Additive for Electrolytic Copper Plating for FCBGA THRU-CUP ETV-13 ・Electroless Au/Pd/Au Process (IGEPIG) ＜NEW＞ ・Electrolytic Cu / Ni / Sn process for bump forming ・MOSL and Eless copper plating process on glass panel ＜NEW＞ ・KCN free Pd removal process ＜NEW＞ NANOMOVER LSK-5 & ACCEMULTA WSN-6 ・Pretreatment process for fine pattern 【Automotive DCB Plating Processes】 ・Pd-free Activator for Cu Materials NIMUDEN ACTIVATOR MNB-2 ・Low Phosphorus Electroless Ni-P Plating Bath with Excellent Solderability NIMUDEN KSL / KSL-2 【Plating System and Plating Solution Controllers】 ・Plating System for UBM / PLP SpeedPlater ・Wafer Process Solution Controllers CHEMiROBO 3 & STARLiNE-DASH 4 NP ・Recycle system for electrolytic copper plating ＜NEW＞ |
| Official website | https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html |