24th IC & Sensor Packaging EXPO（ISP 2023）
C. Uyemura ＆ Co., Ltd. will be exhibiting at 24th IC & Sensor Packaging EXPO（ISP 2023）. We are looking forward to seeing you at our booth.
| Dates | Jan.25(Wed), 2023 - Jan.27(Fri), 2023 10:00～17:00 |
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| Venue | Tokyo Big Sight |
| Booth number | East hall 3, 24-1 |
| Exhibited products | 【Wafer Plating Processes】 ・UBM Forming Process on Al or Cu Pad EPITHAS Process ・Additive for Electrolytic Copper Post Plating EPITHAS EPT-H ・Additive for Electrolytic Copper RDL Plating ＜NEW＞ EPITHAS EDL-02 ・Electrolytic Sn-Ag Alloy Process for Wafer Bumping ＜NEW＞ EPITHAS GRD-4 【Automotive DCB Plating Processes】 ・Pd-free Activator for Cu Materials ＜NEW＞ NIMUDEN ACTIVATOR MNB-2 ・Low Phosphorus Electroless Ni-P Plating Bath with Excellent Solderability ＜NEW＞ NIMUDEN KSL / KSL-2 ・Autocatalytic Type Silver Bath ＜NEW＞ ARJENTE RSD-4 (ver. MT2) 【Package Substrate Plating Processes】 ・Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP APPDES Process / ALCUP Process ・Electroless Copper Plating for Fine Pattern SAP THRU-CUP PEAV6 ・Electroless Copper Plating with Excellent Coverage in BVH THRU-CUP PTU ・Additive for Electrolytic Copper Plating for Fine Pattern THRU-CUP EMB-02 ・Additive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern ＜NEW＞ THRU-CUP EVF-YF7 / EVF-YF9 ・Additive for Electrolytic Copper Plating Post Plating for FO-PLP THRU-CUP EST-01 ・Additive for Electrolytic Copper Plating for FCBGA ＜NEW＞ THRU-CUP ETV-11 ・Cyanide-free Electroless Gold Bath ＜NEW＞ GOBRIGHT TNC-25 / TNC-47 ・Electroless Pd Bath for Ni/Pd/Au Process（ENEPIG） ＜NEW＞ Pd-P : ALTAREA TPD-35 Pure Pd : ALTAREA TPD-23 ・Immersion Gold / Electroless Palladium / Immersion Gold Electroless Au/Pd/Au Process（IGEPIG） 【Plating System and Plating Solution Controllers】 ・Plating System for UBM / PLP SpeedPlater ・Wafer Process Solution Controllers CHEMiROBO 3 & STARLiNE-DASH 4 NP |
| Official website | https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html |