SEMICON Japan / APCS 2022
C. Uyemura ＆ Co., Ltd. will be exhibiting as "JOINT2" at Advanced Packaging and Chiplet Summit (APCS) 2022 in SEMICON Japan 2022.
We are looking forward to seeing you at our booth.
We are looking forward to seeing you at our booth.
| Dates | Dec.14(Wed), 2022 - Dec.16(Fri), 2022 10:00～17:00 |
|---|---|
| Venue | Tokyo Big Sight（East hall） |
| Booth number | 3853 |
| Exhibited products | Fine bump forming and fine circuit interconnect for semiconductor packaging of next generation |
| Official website | https://www.semiconjapan.org/en/apcs |