SEMICON Japan / APCS 2022

C. Uyemura & Co., Ltd. will be exhibiting as "JOINT2" at Advanced Packaging and Chiplet Summit (APCS) 2022 in SEMICON Japan 2022.
We are looking forward to seeing you at our booth.

Dates Dec.14(Wed), 2022 - Dec.16(Fri), 2022 10:00~17:00
VenueTokyo Big Sight(East hall)
Booth number3853
Exhibited productsFine bump forming and fine circuit interconnect for semiconductor packaging of next generation
Official website

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