Product Research

Copper Plating Process

• PTH process​
• Semi-additive build-up process (SAP)​
• Direct plating PALLADIGM process​

Final Finish Process

• ENIG, ENEPIG, ENAG, Thin Ni ENEPIG process for organic substrates​
• EPIG process​
• IGEPIG process​
• MSP (Metallic Solderability Preservative) process for organic substrates​
• ENAG process for ceramic substrates (W, Mo circuits)​
• ENAG process for glass ceramic substrates​
• Electrolytic Ni/Pd/Au plating process​
• Electrolytic Ni/Au plating process​
• Electrolytic Ni/Sn plating process for bump formation​

Electrolytic Plating Process

• Copper pillar plating process​
• RDL plating process​

Electroless Plating Process

• Pretreatment process for aluminum pad​
• Pretreatment process for copper pad​
• UBM process​
• Electolytic plating process for bump formation​

• Electrolytic Tin and Tin Alloy Plating Process for Lead Frames
• Electrolytic Tin Plating Process for Chip Parts

• AD Process (Hard Disk Media Ni-P Plating Process)