Conference presentation
C. Uyemura ＆ Co., Ltd. has presented at the following academic conference.
| Title | Solder joint reliability of middle P% and high P% Ni/Au with low melting point solder containing Indium |
|---|---|
| Speaker | Mutsumi Komeyama |
| Dates | Oct.19(Sun), 2025 - Oct.23(Thu), 2025 |
| Organaizer | The Surface Mount Technology Association |
| Conference | SMTA International |