SEMICON Japan / APCS 2024
C. Uyemura ＆ Co., Ltd. will be exhibiting at Advanced Packaging and Chiplet Summit (APCS) 2024 in SEMICON Japan 2024.
We are looking forward to seeing you at our booth.
We are looking forward to seeing you at our booth.
| Dates | Dec.11(Wed), 2024 - Dec.13(Fri), 2024 10:00～17:00 |
|---|---|
| Venue | Tokyo Big Sight |
| Booth number | East Hall 3 3755 |
| Exhibited products | ・Additive for Periodic Pulse Reverse (PPR) Copper Plating for Through-hole Filling THRU-CUP EXP-01 ・Formaldehyde-free Electroless Copper Plating for Wafer EPITHAS PAN-25 ・Additive for Electrolytic Copper Post Plating EPITHAS EPT-H ・Elctrolytic Cu/Ni/Sn-Ag Alloy Plating for Wafer Bumping ・Electroless Ni Bath with Excellent Crack Resistance After Heating EPITHAS KLL-2 ・Acidic Pretreatment Process for UBM on Al Material EPITHAS MCE-51 & EPITHAS MCS-31 |
| Official website | https://www.semiconjapan.org/en |