SEMICON Japan / APCS 2023
C. Uyemura ＆ Co., Ltd. will be exhibiting at Advanced Packaging and Chiplet Summit (APCS) 2023 in SEMICON Japan 2023.
We are looking forward to seeing you at our booth.
We are looking forward to seeing you at our booth.
| Dates | Dec.13(Wed), 2023 - Dec.15(Fri), 2023 10:00～17:00 |
|---|---|
| Venue | Tokyo Big Sight |
| Booth number | East Hall 1 1029 |
| Exhibited products | ・Electrolytic Cu / Ni / Sn-Ag Alloy process for Wafer Bumping ・Additive for Electrolytic Copper RDL Plating EPITHAS EDL-02 ・Formaldehyde-free Neutral Electroless Copper Plating EPITHAS PHP-4 ・Electroless Silver (ES) Bath with autocatalytic reaction EPITHAS RSL-34 |
| Official website | https://www.semiconjapan.org/en/apcs |