JPCA Show 2022

C. Uyemura & Co., Ltd. will be exhibiting at JPCA Show 2022. We are looking forward to seeing you at our booth.

Dates Jun.15(Wed), 2022 - Jun.17(Fri), 2022 10:00~17:00
VenueTokyo Big Sight
Booth numberEast hall 5, 5G-06
Exhibited products【Supporting to the New Circuit Technology】
・Desmear and Electroless Copper Pretreatment for Low Profile Resin of SAP
 APPDES Process / ALCUP Process

・Electroless Copper Plating for Fine Pattern SAP
 THRU-CUP PEAV6

・Electroless Copper Plating with Excellent Coverage in BVH
 THRU-CUP PTU

・Additive for Electrolytic Copper Plating for Fine Pattern
 THRU-CUP EMB-02
 
・Additive for Electrolytic Copper Plating for BVH/LTH Filling and Pattern <NEW>
 THRU-CUP EVF-YF7 / EVF-YF9

・Additive for Electrolytic Copper Plating Post Plating for FO-PLP
 THRU-CUP EST-01

・New Type Vertical Continuous Plating System
 U-VCPS

・Plating System for UBM / PLP
 SpeedPlater

【Supporting to the High Reliability for Flexible Board】
・Direct Plating Process for FPC and RF
 PALLADIGM Process

【Supporting to the New Mounting Technology】
・Cyanide-free Electroless Gold Bath <NEW>
 GOBRIGHT TNC-25 / TNC-47

・Electroless Pd Bath for Ni/Pd/Au Process (ENEPIG) <NEW>
 Pd-P: ALTAREA TPD-35
 Pure Pd: ALTAREA TPD-23

・Electroless Au/Pd/Au Process (IGEPIG)

・Autocatalytic Type Silver Bath for Ag Sinter Joint Reliability <NEW>
 ARJENTE RSD-4 (ver. MT2)

・Automation Solution Controller for All Processes of PCB Plating <NEW>
 CHEMiROBO 3 & STARLiNE-DASH 4 NP
Official websitehttps://www.jpcashow.com/show2022/en/index.html

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