SEMICON Japan 2025
C. Uyemura ＆ Co., Ltd. will be exhibiting at SEMICON Japan 2025. We are looking forward to seeing you at our booth.
| Dates | Dec.17(Wed), 2025 - Dec.19(Fri), 2025 10:00～17:00 |
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| Venue | Tokyo Big Sight |
| Booth number | In front of the entrance to East Exhibition Hall 4 |
| Exhibited products | Advanced Plating Solutions Empowering Fine Wiring and Interconnection Technologies in Next-Generation Packaging Driven by the rising demand for 2.5D (2.XD) and 3D integration technologies, we develop advanced plating solutions that enable chiplet integration across multi-die and vertically stacked architectures. At the forefront of chiplet integration, we deliver a comprehensive suite of plating solutions encompassing copper plating processes for fine-pattern formation on interposers and HBM’s third-level packaging, along with precision bump plating engineered for reliable die-to-interposer interconnections. 【Product Lineup】 ・EPITHAS EPT-H Electrolytic Copper Post Plating ・EPITHAS EHK-12 Electrolytic Copper RDL Plating ・EPITHAS GRD-4 Process for Sn-Ag Bump Forming ・EPITHAS EHK-09 Electrolytic Copper TSV Plating ・EPITHAS PAN-25 Formaldehyde-free Electroless Copper Plating for Wafer ・Wafer Process Solution Controllers CHEMiROBO 3 & STARLiNE-DASH 4 NP ・Plating System for UBM / PLP SpeedPlater 【In-booth Presentation】 Electrolytic copper plating for RDL and electrolytic plating process for fine bumps |
| Official website | https://www.semiconjapan.org/en |